[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Electronic packages for high pressure applications: A dome-shaped cavity design
Rong, Eric Phua Jian, Riko, I Made, Sharif, Ahmed, Cheong, Wong Chee, Zhong, Chen, MinWoo, Daniel Rhee, Lip, Gan CheeAnnée:
2013
Langue:
english
DOI:
10.1109/ectc.2013.6575911
Fichier:
PDF, 952 KB
english, 2013