[IEEE Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. - Shanghai, China (2006.06.27-2006.06.28)] Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. - Role of Cu contents in the isothermal metallurgical reaction for the flip chip Sn-3.0Ag-[0.5 or 1.5]Cu joints with Cu/electroless Ni-P/immersion Au bonding pad during aging