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[IEEE 7th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - Enschede, The Netherlands (8-11 October 1996)] Proceedings of the 7th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - Design of a test structure to evaluate electro-thermomigration in power ICs
de Munari, I., Speroni, F., Reverberi, M., Neva, C., Lonzi, L., Fantini, F.Année:
1996
Langue:
english
DOI:
10.1109/esref.1996.888236
Fichier:
PDF, 269 KB
english, 1996