[IEEE 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Delft, The Netherlands (2009.04.26-2009.04.29)] EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Rigid-Flexible Printed Circuit structure optimization by simulations
Sun, Hai-bo, Shi, Ming-quan, Yang, Ping, Zhong, Jian, Chen, Quayle, Xue, Tom, Zhao, Tiejun, Xu, Leon, Salo, AnttiAnnée:
2009
Langue:
english
DOI:
10.1109/esime.2009.4938419
Fichier:
PDF, 2.52 MB
english, 2009
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