[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - A new embedded helix-type inductor using LTCC technology for high frequency applications
Liu, Dong, Liu, Yingli, Li, YuanxunAnnée:
2009
Langue:
english
DOI:
10.1109/icept.2009.5270731
Fichier:
PDF, 1.06 MB
english, 2009