[IEEE IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Austin, TX, USA (Oct. 24-26, 2005)] IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Losses caused by roughness of metallization in prnted-circuit boards
Deutsch, A., Surovic, C., Krabbenhoft, R., Kopcsay, G.V., Chamberlin, B.Année:
2005
Langue:
english
DOI:
10.1109/epep.2005.1563695
Fichier:
PDF, 1.87 MB
english, 2005