[IEEE 2010 IEEE International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2010.06.6-2010.06.9)] 2010 IEEE International Interconnect Technology Conference - Capturing intrinsic impact of low-k dielectric stacks and packaging materials on mechanical integrity of Cu/low-k interconnects
Furusawa, Takeshi, Goto, Kinya, Izumitani, Junko, Matsuura, Masazumi, Fujisawa, Masahiko, Kawanabe, Naoki, Hirose, Tetsuya, Hayashi, Eiji, Baba, Shinji, Asano, Yoshinobu, Ichiki, Tsutom, Takata, YoshiAnnée:
2010
Langue:
english
DOI:
10.1109/iitc.2010.5510312
Fichier:
PDF, 691 KB
english, 2010
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