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An Integrated Experimental and Computational System for the Thermal Characterization of Complex Three-Dimensional Submicron Electronic Devices
Raad, Peter E., Komarov, Pavel L., Burzo, Mihai G.Volume:
30
Langue:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2007.910043
Date:
December, 2007
Fichier:
PDF, 1.66 MB
english, 2007