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Effect of Die-Bonding Process on MEMS Device Performance: System-Level Modeling and Experimental Verification
Jing Song,, Qing-An Huang,, Ming Li,, Jie-Ying Tang,Volume:
18
Langue:
english
Journal:
Journal of Microelectromechanical Systems
DOI:
10.1109/jmems.2008.2011105
Date:
April, 2009
Fichier:
PDF, 1.30 MB
english, 2009