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[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Thermal fatigue life simulation on DDR3 package
Ng Hong Wan,Année:
2011
Langue:
english
DOI:
10.1109/eptc.2011.6184528
Fichier:
PDF, 843 KB
english, 2011