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[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Manufacturing readiness of BVA technology for ultra-high bandwidth package-on-package
Katkar, Rajesh, Co, Rey, Zohni, WaelAnnée:
2014
Langue:
english
DOI:
10.1109/ectc.2014.6897474
Fichier:
PDF, 2.70 MB
english, 2014