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[IEEE 2009 IEEE 9th Malaysia International Conference on Communications (MICC) - Kuala Lumpur, Malaysia (2009.12.15-2009.12.17)] 2009 IEEE 9th Malaysia International Conference on Communications (MICC) - Characterization of on-wafer RF passive components for RFIC devices using three-steps de-embedding method
Siti, Maisurah M.H., Mohd, Nizam O., Marzuki, A., Rahim, A.I. Abdul, Mohamed, Razman YAnnée:
2009
Langue:
english
DOI:
10.1109/micc.2009.5431531
Fichier:
PDF, 1.88 MB
english, 2009