[IEEE Conference Publications Design Automation and Test in Europe - Dresden, Germany (2014.03.24-2014.03.28)] Design, Automation & Test in Europe Conference & Exhibition (DATE), 2014 - Efficient transient thermal simulation of 3D ICs with liquid-cooling and through silicon vias
Fourmigue, Alain, Beltrame, Giovanni, Nicolescu, GabrielaAnnée:
2014
Langue:
english
DOI:
10.7873/date.2014.087
Fichier:
PDF, 708 KB
english, 2014