[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Bordeaux, France (2010.04.26-2010.04.28)] 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) - Thermo-mechanical simulation of a SiP (System-in-a-Package) LGA (Land Grid Array): Impact of the internal IC (Integrated Circuits) on the 2nd level solder joint reliability
Chaillot, A., Munier, C., Maire, O., Vigier, M., Chastanet, C.Année:
2010
Langue:
english
DOI:
10.1109/ESIME.2010.5464579
Fichier:
PDF, 17.77 MB
english, 2010
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