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[IEEE 2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - San Hose, CA, USA (2014.5.20-2014.5.23)] IEEE International Interconnect Technology Conference - Plasma-enhanced CVD low-k process enabling global planarity by controlling flowability
Ishikawa, Dai, Nakano, Akinori, Ueda, Shintaro, Kou, Hiroshi, Arai, Hirofumi, Kobayashi, Akiko, Matsushita, Kiyohiro, Kobayashi, NobuyoshiAnnée:
2014
Langue:
english
DOI:
10.1109/iitc.2014.6831862
Fichier:
PDF, 595 KB
english, 2014