[IEEE 2009 IEEE International Electron Devices Meeting (IEDM) - Baltimore, MD, USA (2009.12.7-2009.12.9)] 2009 IEEE International Electron Devices Meeting (IEDM) - Chip-level and package-level seamless interconnect technologies for advanced packaging
Yamamichi, Shintaro, Mori, Kentaro, Kikuchi, Katsumi, Murai, Hideya, Ohshima, Daisuke, Nakashima, Yoshiki, Soejima, Koji, Kawano, Masaya, Murakami, TomooAnnée:
2009
Langue:
english
DOI:
10.1109/iedm.2009.5424273
Fichier:
PDF, 2.64 MB
english, 2009