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[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Integration and manufacturing aspects of moving from WaferBOND HT-10.10 to ZoneBOND material in temporary wafer bonding and debonding for 3D applications
Jourdain, Anne, Phommahaxay, Alain, Verbinnen, Greet, Murdoch, Gayle, Miller, Andy, Rebibis, Kenneth, Guerrero, Alice, McCutcheon, Jeremy, Privett, Mark, Neidrich, Jason, Beyer, Gerald, Beyne, EricAnnée:
2013
Langue:
english
DOI:
10.1109/ectc.2013.6575559
Fichier:
PDF, 1009 KB
english, 2013