
[IEEE 2011 Materials for Advanced Metallization (MAM) - Dresden, Germany (2011.05.8-2011.05.12)] 2011 IEEE International Interconnect Technology Conference - Investigation of ultra-thin Al2O3 film as Cu diffusion barrier on low-k (k=2.5) dielectrics
Ding, Shao-Feng, Xie, Qi, Chen, Fei, Lu, Hai-Sheng, Deng, Shao-Ren, Detavernier, Christophe, Ru, Guo-Ping, Jiang, Yu-Long, Qu, Xin-PingAnnée:
2011
Langue:
english
DOI:
10.1109/iitc.2011.5940321
Fichier:
PDF, 474 KB
english, 2011