[IEEE 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, China (2013.07.15-2013.07.19)] Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - New technique of sample preparation for 3DIC micro_bumps observation
Chun-An Huang,, Han-Yun Long,, King-Ting Chiang,, Li Chuang,, Tsui, KevinAnnée:
2013
Langue:
english
DOI:
10.1109/ipfa.2013.6599142
Fichier:
PDF, 1022 KB
english, 2013