Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
2007 Vol. 576; Iss. 1

Special bump bonding technique for silicon pixel detectors
Enric Cabruja, Marc Bigas, Miguel Ullan, Giulio Pellegrini, Manuel LozanoVolume:
576
Année:
2007
Langue:
english
Pages:
4
DOI:
10.1016/j.nima.2007.01.143
Fichier:
PDF, 590 KB
english, 2007