[IEEE 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Belgium (2014.04.7-2014.04.9)] 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Electronic control package model calibration using moiré interferometry
Dae-Suk Kim,, Han, Bongtae, Yadur, Arjun, Gromala, Przemyslaw JakubAnnée:
2014
Langue:
english
DOI:
10.1109/eurosime.2014.6813835
Fichier:
PDF, 1.80 MB
english, 2014