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[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - Research on Creep Properties of SnAgCuRE Lead-Free Soldered Joints
Zhang, Keke, Yang, Jie, Wang, Yaoli, Fan, Yanli, Zhang, Xin, Yan, YanfuAnnée:
2006
Langue:
english
DOI:
10.1109/icept.2006.359657
Fichier:
PDF, 3.32 MB
english, 2006