[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Solder joints reliability with different Cu plating current density in Wafer Level Chip Scale Packaging (WLCSP)
Cao, Kenny, Tan, Kh, Lai, Cm, Zhang, LiAnnée:
2009
Langue:
english
DOI:
10.1109/icept.2009.5270633
Fichier:
PDF, 1.20 MB
english, 2009