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Effects of STI-fill thickness on the CMP process defects
Yong-Jin Seo, Gi-Uk Kim, Woo-Sun LeeVolume:
71
Année:
2004
Langue:
english
Pages:
6
DOI:
10.1016/j.mee.2003.11.005
Fichier:
PDF, 406 KB
english, 2004