[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Fast electrical-thermal co-simulation using multigrid method for 3D integration
Xie, Jianyong, Swaminathan, MadhavanAnnée:
2012
Langue:
english
DOI:
10.1109/ectc.2012.6248901
Fichier:
PDF, 745 KB
english, 2012