[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Assembly and reliability of advanced packaging technologies in high speed networking applications
Savic, John, Aria, Percy, Priest, Judy, Ahmad, Mudasir, Hubbard, Ken, Pomerleau, Real, Teng, Sue, Nagar, Mohan, Xue, JieAnnée:
2010
Langue:
english
DOI:
10.1109/ectc.2010.5490845
Fichier:
PDF, 1.58 MB
english, 2010