Scrapping Small Lots in a Low-Yield and High-Price Scenario
Wu, M.-C., Chiou, C.-W., Hsu, H.-M.Volume:
17
Langue:
english
Journal:
IEEE Transactions on Semiconductor Manufacturing
DOI:
10.1109/tsm.2003.822732
Date:
February, 2004
Fichier:
PDF, 676 KB
english, 2004