[IEEE 2006 1st Electronic Systemintegration Technology Conference - Dresden, Germany (2006.09.5-2006.09.7)] 2006 1st Electronic Systemintegration Technology Conference - Thermal Characterization of Multi Stack Packages Using Linear Superposition Method
Yoo, Jaewook, Im, Yunhyeok, Choi, Kiwon, Cho, Taeje, Kang, Sayoon, Oh, SeyongAnnée:
2006
Langue:
english
DOI:
10.1109/estc.2006.280163
Fichier:
PDF, 4.95 MB
english, 2006