[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Ground via optimization on substrate for high speed signal transmission
Jing Zhou,, Wei Gao,, Baoxia Li,, Qidong Wang,, Xia Zhang,, Liqiang Cao,, Lixi Wan,Année:
2010
Langue:
english
DOI:
10.1109/icept.2010.5583793
Fichier:
PDF, 747 KB
english, 2010