[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Novel multi-layer wiring build-up using Electrochemical Pattern Replication (ECPR)
Fredenberg, Mikael, Moller, Patrik, Topper, MichaelAnnée:
2009
Langue:
english
DOI:
10.1109/ectc.2009.5074072
Fichier:
PDF, 2.48 MB
english, 2009