Optimization of desmear process for high adhesion of insulating film in printed circuit boards (PCBs) via Taguchi method
Moon Soo Park, Jae Choon Cho, Sung Hyun Kim, Dong Joo Shin, Hyung mi Jung, Choon Keun Lee, Mi-Suk Cho, Youngkwan LeeVolume:
31
Année:
2011
Langue:
english
Pages:
7
DOI:
10.1016/j.ijadhadh.2011.04.004
Fichier:
PDF, 1.38 MB
english, 2011