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[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Copper direct bonding: An innovative 3D interconnect
Gueguen, Pierric, Di Cioccio, Lea, Morfouli, Panagiota, Zussy, Marc, Dechamp, Jerome, Bally, Laurent, Clavelier, LaurentAnnée:
2010
Langue:
english
DOI:
10.1109/ectc.2010.5490697
Fichier:
PDF, 1.32 MB
english, 2010