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[IEEE 2009 IEEE International Solid-State Circuits Conference (ISSCC 2009) - San Francisco, CA (2009.02.8-2009.02.12)] 2009 IEEE International Solid-State Circuits Conference - Digest of Technical Papers - A 4-side tileable back illuminated 3D-integrated Mpixel CMOS image sensor
Suntharalingam, V., Berger, R., Clark, S., Knecht, J., Messier, A., Newcomb, K., Rathman, D., Slattery, R., Soares, A., Stevenson, C., Warner, K., Young, D., Lin Ping Ang,, Mansoorian, B., Shaver, D.Année:
2009
Langue:
english
DOI:
10.1109/isscc.2009.4977296
Fichier:
PDF, 1.11 MB
english, 2009