[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - Wire bonding optimization with fine copper wire for volume production
Yauw, Oranna, Clauberg, Horst, Kuan Fang Lee,, Liming Shen,, Chylak, BobAnnée:
2010
Langue:
english
DOI:
10.1109/eptc.2010.5702685
Fichier:
PDF, 1.30 MB
english, 2010