[IEEE Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Shanghai, China (30 June-3 July 2004)] Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - The effects of laser reflow conditions on the formation of intermetallic compounds at Sn3.0Ag0.5Cu solder/Cu joint interface
Wei Liu,, Chunqing Wang,, Mingyu Li,, Yanhong Tian,, Jingwei Guan,Année:
2004
Langue:
english
DOI:
10.1109/hpd.2004.1346676
Fichier:
PDF, 945 KB
english, 2004