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[IEEE 2006 8th Electronics Packaging Technology Conference - Singapore (2006.12.6-2006.12.8)] 2006 8th Electronics Packaging Technology Conference - Thermal characterization of multi-die packages
Poppe, Andras, Zhang, Yan, Farkas, Gabor, Wong, Hon, Wilson, John, Szabo, PeterAnnée:
2006
Langue:
english
DOI:
10.1109/eptc.2006.342764
Fichier:
PDF, 823 KB
english, 2006