[IEEE International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (11-14 March 2001)] Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) - Let's revise the ASTM method F.459 for wirebonding process control
Cuong Van Pham,, Huth, K.Année:
2001
Langue:
english
DOI:
10.1109/isaom.2001.916573
Fichier:
PDF, 517 KB
english, 2001