Test Chip for the Development and Evaluation of Sensors for Measuring Stress in Metal Interconnects
Terry, J.G., Smith, S., Walton, A.J., Gundlach, A.M., Stevenson, J.T.M., Horsfall, A.B., Wang, K., dosSantos, J.M.M., Soare, S.M., Wright, N.G., O'Neill, A.G., Bull, S.J.Volume:
18
Langue:
english
Journal:
IEEE Transactions on Semiconductor Manufacturing
DOI:
10.1109/tsm.2005.845096
Date:
May, 2005
Fichier:
PDF, 2.31 MB
english, 2005
File converter
Plus de résultats de recherche
More benefits 
