[IEEE 2009 IEEE International Interconnect Technology Conference - IITC - Sapporo, Japan (2009.06.1-2009.06.3)] 2009 IEEE International Interconnect Technology Conference - Novel low-k SiOC (k=2.4) with superior tolerance to direct polish and ashing for advanced BEOL integration
Asami, N., Owada, T., Akiyama, S., Ohara, N., Iba, Y., Kouno, T., Kudo, H., Takesako, S., Osada, T., Kirimura, T., Watatani, H., Uedono, A., Nara, Y., Kase, M.Année:
2009
Langue:
english
DOI:
10.1109/iitc.2009.5090373
Fichier:
PDF, 428 KB
english, 2009