[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - Evaluation of low cure temperature dielectric materials for EMWLP and TSV
Fernandez, D.M., Soon Wee Ho David,, Wai Hong See Toh Justin,, Siow, Li Yan, Rao, Vempati SrinivasaAnnée:
2010
Langue:
english
DOI:
10.1109/eptc.2010.5702598
Fichier:
PDF, 3.92 MB
english, 2010