[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Process and reliability assessment of 200μm-thin embedded wafer level packages (EMWLPs)
Kim, Hyoung Joon, Chong, Ser Choong, Ho, David Soon Wee, Yong, Eric Woon Yik, Khong, Chee Houe, Teo, Calvin Wei Liang, Fernandez, Daniel Moses, Lau, Guan Kian, Vasarla, Nagendra Sekhar, Lee, Vincent WAnnée:
2011
Langue:
english
DOI:
10.1109/ECTC.2011.5898495
Fichier:
PDF, 1.73 MB
english, 2011
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