[IEEE 1997 1st Electronic Packaging Technology Conference - Singapore (8-10 Oct. 1997)] Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307) - Effect of package construction on thermal performance of plastic IC packages
Bhandarkar, N., Mhaisalkar, S., Lee, P., Tracy, D.Année:
1997
Langue:
english
DOI:
10.1109/EPTC.1997.723887
Fichier:
PDF, 391 KB
english, 1997