[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Properties of Cu-Al intermetallic compounds in copper wire bonding
Binhai Zhang,, Techun Wang,, Yuqi Cong,, Mike Zhao,, Xiangquan Fan,, Jiaji Wang,Année:
2010
Langue:
english
DOI:
10.1109/icept.2010.5582439
Fichier:
PDF, 1.01 MB
english, 2010