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Effect of alloy seed on Cu interconnect electromigration and stress migration
Zhao, XiangFu, Wu, Jeff, Chang, VensonVolume:
129
Langue:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2014.07.024
Date:
November, 2014
Fichier:
PDF, 1.82 MB
english, 2014