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[IEEE IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging - San Diego, CA, USA (25-27 Oct. 1999)] IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) - Validation of integrated capacitor-via-planes model
Yuan-Liang Li,, Figueroa, D.G., Teong Guan Yew,, Chee Yee Chung,Année:
1999
Langue:
english
DOI:
10.1109/EPEP.1999.819207
Fichier:
PDF, 283 KB
english, 1999