[IEEE 2013 IEEE International Interconnect Technology Conference - IITC - Kyoto, Japan (2013.06.13-2013.06.15)] 2013 IEEE International Interconnect Technology Conference - IITC - Modeling of interconnect stress evolution during BEOL process and packaging
Shah, Chirag, Karmarkar, Aditya, Xu, XiaopengAnnée:
2013
Langue:
english
DOI:
10.1109/IITC.2013.6615558
Fichier:
PDF, 1.05 MB
english, 2013