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[IEEE 2009 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) - Berlin, Germany (2009.05.10-2009.05.12)] 2009 IEEE/SEMI Advanced Semiconductor Manufacturing Conference - Quantifying yield impact of polishing induced defect on the silicon surface
Hideo Ohta,, Sang Hyun Lee,, Tetsuya Watanabe,, Park, Sung Ki, Byeong Sam Moon,, Jeong Hoon An,, Katsuhiko Ichinose,, Park, Jea Gun, Kwon Hong,, Kazunori Nemoto,Année:
2009
Langue:
english
DOI:
10.1109/ASMC.2009.5155950
Fichier:
PDF, 1.12 MB
english, 2009