The fabrication of back etching 3C-SiC-on-Si diaphragm employing KOH + IPA in MEMS capacitive pressure sensor
Marsi, Noraini, Majlis, Burhanuddin Yeop, Mohd-Yasin, Faisal, Hamzah, Azrul AzlanVolume:
21
Langue:
english
Journal:
Microsystem Technologies
DOI:
10.1007/s00542-014-2267-8
Date:
August, 2015
Fichier:
PDF, 4.12 MB
english, 2015