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Alkoxysilane Layers Compatible with Copper Deposition for Advanced Semiconductor Device Applications
Rébiscoul, Diane, Perrut, Vincent, Morel, Thierry, Jayet, Céline, Cubitt, Robert, Haumesser, Paul-HenriVolume:
26
Langue:
english
Journal:
Langmuir
DOI:
10.1021/la904771s
Date:
June, 2010
Fichier:
PDF, 4.08 MB
english, 2010