[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - 12-channel board-level multi-GHz optical link using cross-switch chips and optoelectronic multi-chip package modules
Fengman Liu,, Zhihua Li,, Wei Gao,, Haifei Xiang,, Jian Song,, Baoxia Li,, Lixi Wan,Année:
2010
Langue:
english
DOI:
10.1109/ICEPT.2010.5583802
Fichier:
PDF, 881 KB
english, 2010